Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review (Adv. Mater. 52/2022)

Development and Modeling of Thermally Conductive Polymer/Carbon Composites

Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-...

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

New interconnection materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. In particular, anisotropic conductive adhesives (ACAs) have gained popularity as a potential replacement for solder interconnects. Despite numerous benefits, ACA-type packages pose several reliability problems. During the l...

Thermally conductive polyamide 6/carbon filler composites based on a hybrid filler system

We explored the use of a hybrid filler consisting of graphite nanoplatelets (GNPs) and single walled carbon nanotubes (SWCNTs) in a polyamide 6 (PA 6) matrix. The composites containing PA 6, powdered GNP, and SWCNT were melt-processed and the effect of filler content in the single filler and hybrid filler systems on the thermal conductivity of the composites was examined. The thermal diffusivit...

Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application

The thermo-mechanical testing of HYSOL FP4549 polymer-filled underfill materials was conducted under different strain rate and temperature environment. A new specimen preparation procedure and further test methodology are developed to characterize the time–temperature mechanical behaviors of underfill materials. The stress–strain behavior of materials is simulated with constitutive framework, a...